This platform allows elevated levels of data storage capacity to be achieved inside a very small form factor. It requires three times less PCB area versus solutions from the competition, and its volume is smaller by a factor of ten.

Versatility is another plus point, with the DDR4T0xG72/TPS7H3301-SP modular platform being applicable across a wide range of space-grade processors (including Teledyne e2v and others), FPGAs/ACAPs (such as AMD/Xilinx, Microchip, NanoXplore, etc.) and custom-built ASICs.

More information on it is available at: https://semiconductors.teledyneimaging.com/en/products/memory/space-radiation-tolerant-4gb-8gb-ddr4/^[2]

"Having access to pre-tested, easy-to-integrate hardware is of real benefit to those constructing systems for space deployment," states Thomas Guillemain, Marketing Manager for Digital Processing Solutions at Teledyne e2v. "This joint platform results in significant value for our space customers, particularly on SWaP."

"The DDR4T0xG72/TPS7H3301-SP solution means that space systems will now have access to a small-format module that saves critical board area and offers high power density and verified radiation hardness and reliability," adds Mark Toth, marketing and applications engineering manager for space-grade power products at TI.

The radiation-validated TI and Teledyne e2v devices that make up this solution are featured in Alpha Data's Versal Core development kit ADK-VA600.

Hashtag: #Teledynee2v

The issuer is solely responsible for the content of this announcement.

References

1. ^{^} Media OutReach (www.media-outreach.com)
2. ^{^} https://semiconductors.teledyneimaging.com/en/products/memory/space-radiation-tolerant-4gb-8gb-ddr4/ (semiconductors.teledyneimaging.com)