As part of the French Recovery Plan, Teledyne e2v Semiconductors and Safran Electronics Defense have jointly obtained a French state aid to develop their System-in-Package roadmap
- Written by Teledyne e2v
Teledyne e2v offers high-performance, ultra-reliable semiconductor solutions addressing critical functions across the entire signal chain – covering data converters, interface ICs, microprocessors, analog switches, voltage references, digitizers, logic, memory and RF devices. Serving the avionics, industrial, medical, military, scientific and space sectors, the company is recognized as a world leader in the re-engineering and up-screening commercial technologies to deal with the most demanding of application scenarios.
Many of Teledyne e2v's products are developed through strategic partnerships with leading semiconductor vendors – such as NXP, Everspin and Micron. By working closely with its global client base, the company is able to provide an expansive array of innovative solutions. These span all the way from standard and semi-custom through to fully customized options.
Website: https://semiconductors.teledyneimaging.com/en/home/[1]
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References
- ^ https://semiconductors.teledyneimaging.com/en/home/ (semiconductors.teledyneimaging.com)
Authors: Teledyne e2v
